“Controlling The Iron Tip Temperature Is Not The Key Element In Soldering”
Soldering is among the first things you learn while entering the world of electronics, yet one of those skills that very few conquer.
BY V.Ramavallabhan, Management & Technical Consultant, JVR Consultants.
How should an engineer go about selecting the right soldering method? This is probably a question that most electronics engineers faced at least in some point in their lives. The first thing you need to do is select the soldering method best suited to your application by considering the pros and cons of each soldering method, as well as the heat resistance of the surface-mount device (SMD).
Selecting the right soldering method
Soldering methods are broadly divided into the partial heating method and total heating method. While heat is applied to…show more content… These are especially related to soldering. Other defects would be component failure due to high soldering temperature or sustained heat transfer due to low conveyor speed. However a good visual inspection and touch up by hand soldering if required, can avoid residual defects of any sort mentioned above after setting up of a good validated process.
The possible defects for reflow soldering process include voids due to poor cleaning action on the pad surface, graping, a phenomenon which appears as poor reflow of solder particles at the top of the solder. Smaller components are also more susceptible to tombstoning (a condition where the components get lifted from the pad with uneven solder paste filled underneath).
Higher temperature and long sustenance of heat will make components susceptible to component failure. This could happen which may be immediate or latent.
Different profile stages of an smt reflow