Electroplating Lab Report

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Background:- Electroplating:- It is a process in which electrical current is used to reduce the dissolved cations hence forming a metal coating on an electrode. The process used here is “Electrodeposition”. Cathode:- It is generally the negative electrode as cations which are positively charged are attracted towards this. It is the part where the metal coat is to plated. Anode:- It is the positive electrode as the anions which are negatively charged are attracted towards this. It is made up of the metal which is to be plated on the cathode. Electrolyte:- It is the solution in which these both electrodes are submerged. It is made up of one or more dissolved metal salts which supply free ions for the current to flow. Research Question…show more content…
This tells us how quickly the nail has been coated with the copper. Temperature being the reason for such increase in the speed of the reaction does affect and increases the rate of electroplating. Controlled:- Concentration of the electrolyte (CuSO4) As the experiment has to be repeated for at least 5 times at different temperatures, the concentration of the electrolyte (CuSO4) should be maintained for different temperatures to get accurate results. The concentration can be checked by using a pH instrument. Volume of the electrolyte (CuSO4) The electrolyte (CuSO4) being heated using the water bath and therefore being transferred from on apparatus to other, care should be taken for the volume to be same for all the temperatures. This can be done by measuring the volume using a measuring cylinder and hence keeping the volume constant and minimizing the errors and uncertainty. Current As the current increases, more electrons move through the circuit hence affecting the rate of electroplating. The current can be controlled using…show more content…
The change in time in each reaction will add huge errors and uncertainty. The more time given to the reaction will lead to more electroplating but decreases the rate of electroplating. So a time of exact 5 minutes should be given for the electroplating. The results obtained are accurate and have fewer errors. Distance between electrodes The distance also affects the rate as the longer the distance between the electrodes, the lower is the rate of electroplating. This happens because the distance being far off, the electrons may take longer time in reaching the electrodes. This will affect the readings. This kept under control by keeping the electrodes at a distance of 10 cm from each others. Surface area of the electrodes dipped in the electrolyte (CuSO4) The larger the surface area of the electrode, higher is the deposition rate. Therefore the surface area of both the electrodes should be kept the same for each reaction. Keeping them constant for each reaction will enhance the perfection of the result. This can be done by submerging 5 cm of both the electrodes. Remember the shape of the both the electrodes should be the same else vary the length according to the shape hence keeping the surface area the same. Materials required:- Copper sheet (anode) Copper sulphate solution (electrolyte

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